Advanced microscopy systems that locate defects, map thermal behavior, and give your engineers the data they need — non-destructively, at sub-micron precision.
Precise Thermal Analysis and Defect Localization
Temperature Measurement Microscopes and Failure Analysis for the Semiconductor Industry
Precision Instruments for Quantitative Thermal Mapping and Failure Analysis
Our product portfolio addresses the two most critical challenges in semiconductor device characterization: understanding precise thermal behavior and locating electrical defects. We also operate a full-service laboratory for organizations that need access to our capabilities without purchasing an instrument.
Temperature Mapping
InfraScope™
Map the Heat. Master the Package.
InfraScope™ delivers precise thermal mapping and failure analysis for engineers developing leading-edge semiconductor packaging — industry-leading accuracy, non-destructive, supporting the next generation.
The InfraScope™ family delivers true temperature mapping for design, packaging, RF, microwave, MEMS, and R&D applications — from steady-state MWIR thermography to high-speed transient events and sub-micron Thermoreflectance (T°Imager™), capturing what no other system can. Our calibrated temperature data goes far beyond relative color maps: engineers can use our measurements directly in reliability models, thermal design rules, and packaging validation workflows.
Failure Analysis
QuantumScope™
From Symptom to Precise Defect Localization.
QuantumScope™ is the industry’s most advanced and complete multi-technique failure analysis system. Multiple sensors, one platform, one setup — maximum defect capture, minimum time to answer.
The QuantumScope™ is the industry’s most versatile multi-sensor failure analysis platform. Combine photoemission microscopy (emmi™), MWIR hot spot detection, and laser signal injection (XIVA™) on a single, modular instrument — without ever moving your device under test. Biasing conditions and test states are fully preserved across every measurement, so there is no setup loss and no time wasted moving samples between systems.
Non-Destructive by Design. One Setup. Every Technique.
Our instruments are built around a simple principle: maximum signal quality, minimum optical complexity. We keep the analytical path direct — no unnecessary beam splitters, relays, or folds that degrade signal. The result is higher sensitivity, faster data collection, and cleaner results at every technique.
Integrated software
Our integrated software allows you to seamlessly switch between techniques from one main pull-down menu. Our interface menu options all have the same look and feel, greatly improving the navigation and ease of use for any user.
Mount once, test everything
Place your device under test (DUT) once. All sensors, optics, and analytical techniques engage from the same central QuantumScope™ platform. Biasing stability and test conditions are fully preserved — because the DUT never moves.
Multi-sensor detection
Switch seamlessly between photoemission, MWIR thermal imaging, and laser signal injection — each sensor on its own slide-mounted stage for a direct, aberration-free optical path. No alignment drift. No technique tradeoffs.
Field-upgradeable modularity
Start with the technique your current work requires, and add capabilities as your needs grow — no new system purchase required. Our modular architecture means your initial investment is not your ceiling. Budget-constrained labs can begin with a single sensor configuration and expand in the field at any time.
Sub-micron defect localization
Our systems are engineered to resolve defects at the scale modern semiconductor nodes demand — pinpointing gate leakage, oxide pinholes, hot spots, junction defects, and via shorts with the spatial precision leading-edge failure analysis requires.
What Our Systems Detect
From photon emissions invisible to the naked eye, to thermal gradients measured in millidegrees — our instruments resolve the failures that other tools miss.
True Temperature Mapping (InfraScope™)
Full-field calibrated thermal maps across packaged devices, bare die, RF and microwave components, MEMS structures, and power devices. Our patented emissivity correction algorithms produce accurate, pixel-by-pixel temperature data — not relative color estimates.
Photoemission (emmi™)
We detect and localize gate leakage, dielectric breakdown, forward-biased junctions, oxide pinholes, and recombination failures — with no physical probing of the die. We hold the original patent on photoemission microscopy for semiconductor failure analysis.
Laser Signal Injection (XIVA™)
We scan a focused laser beam across the IC while monitoring I/V response. This rapidly locates shorts, junction defects, resistive VIAs, and other electrically active anomalies — including dynamic failures that only manifest under test vector conditions.
MWIR Hot Spot Detection (Thermal-HS)
Our mid-wave infrared sensors locate ohmic faults through self-heating signatures, capturing radiant emissions from defect sites at the die and interconnect level. We have delivered hot spot detection systems to semiconductor labs worldwide since the 1960s through our predecessor, Barnes Engineering.
Test Services
InfraScope™ and QuantumScope™
Not ready to invest in your own system? Our Vista, California lab delivers full temperature mapping and failure analysis services using our own InfraScope™ and QuantumScope™ instruments. You work directly with the same engineers who designed and built the systems — fast turnaround, expert defect localization, and the precise data your team needs to take the next step toward root cause — without the capital investment
Over 60 Years of IR Microscopy Leadership
Our roots trace to EDO/Barnes Engineering, the inventors of infrared temperature measurement for semiconductors. We have been solving the industry’s hardest device failures since the 1960s — longer than most of our competitors have existed.
Frequently Asked Questions
Semiconductor thermal and failure analysis microscopy refers to a set of imaging and measurement techniques used to identify how and why integrated circuits and electronic devices fail or overheat. Common techniques include infrared thermal mapping, photoemission microscopy, and laser signal injection microscopy. Our InfraScope™ and QuantumScope™ systems are specifically engineered for these applications — integrating multiple techniques on a single platform so engineers can cross-correlate data without moving the sample.
We locate and characterize gate oxide failures, junction leakage, latch-up conditions, thermal hotspots, and electrically active defects that produce measurable photon emission or thermal signatures under bias. Our QuantumScope™ can identify open lines, ohmic shorts, impedance issues, leakage currents, leaky capacitors, timing errors, oxide defects, resistive vias, ESD damage, and dynamic failures — all from a single instrument setup.
Yes. Our laboratory provides access to our full failure analysis and temperature measurement capabilities on a service basis. This is the right fit for organizations with occasional analysis needs, time-critical projects, or those evaluating whether an in-house system fits their requirements.
Yes. Our systems are designed around field-upgradeable modularity — you can begin with one sensor technique and add photoemission, MWIR, or laser signal injection capabilities later, without replacing the base system. InfraScope™ systems can also be built across basic microscope, probe station, ATE docking, and portable LabWalker™ platforms. When your needs diverge from our standard configurations, we design custom mechanical platforms and analytical solutions to match.
We offer detailed technical publications and application notes for all of our instrument families. Use the Information Request form to select the publications relevant to your application and submit your contact details — we’ll send them directly to you.
Ready to Solve Your Next Failure Analysis Challenge?
Whether you need an instrument system, a single analysis, or a conversation with our engineers — we have the expertise and tools to support your work.