Thermal-HS Infrared Hot Spot Detection

High-sensitivity infrared hot spot detection for semiconductor fault localization — front side and backside.

QFI Dynamic Techniques Commonly Produce Data at µK Sensitivity Levels

Beyond Liquid Crystal. Far Beyond.

For decades, liquid crystal was the standard approach to finding shorts in semiconductor devices. But it comes with significant limitations — low sensitivity (especially from the backside), slow response, hazardous materials handling, and results that are difficult to interpret. Thermal-HS eliminates all of those compromises.

Our Thermal-HS system uses a medium-wave infrared (MWIR) sensor to detect hot spots from their self-generated heat. Because heat radiates in the infrared spectral range and silicon is transparent to MWIR wavelengths, Thermal-HS works equally well from the front side and backside of the device — without any preparation, application of materials, or operator exposure to hazardous substances.

We have been the world’s leading supplier of infrared hot spot detection systems for many years. Thermal-HS delivers a broader range of defect detection capability with far greater ease of use and sensitivity than any liquid crystal approach.

Four Detection Modes for Every Application

Thermal-HS offers four complementary detection modes — from fast steady-state screening to µK-level sensitivity for the most demanding fault localization challenges.

Steady-State

The proven foundation of hot spot detection. Applies DC bias and captures the thermal image directly — the fastest method for devices with high power dissipation or those that cannot be modulated. Best for straightforward short localization where the defect produces sufficient heating.

Modulation Mode

For defects that produce only subtle thermal signatures, Modulation Mode dramatically increases sensitivity through binary on/off power modulation combined with our proprietary averaging algorithms. Signal-to-noise performance improves continuously with acquisition time — µK level sensitivity is common.

Pulse Sampling Thermography (PST)

Our newest quadrature image modulation technique adds bi-level power modulation, bi-mode logic state modulation, and direct extraction of thermal rise time — critical for Z-depth capture of hot spot data in 3D device structures. PST delivers µK level sensitivity without requiring phase interpretation by the user.

Movie Mode

Captures dynamic thermal events at frame rates from 40 fps up to 2,000 frames over 5 seconds — or extended captures up to 10 hours. Ideal for detecting transient faults such as thermal spikes at power-on that no other method will capture. Results can be played back consecutively or stepped through frame by frame.

Choosing the Right Detection Mode

Each Thermal-HS detection mode is optimized for a different class of application. Use the table below to identify the best approach for your fault localization challenge.

	Steady-State	Modulation Mode / PST	Movie Mode
Best for	High power defects; devices that cannot be modulated	Very low power shorts; subtle thermal signatures; 3D depth analysis	Transient faults; thermal spikes at power-on
Sensitivity	~10 mK	µK level (improves with acquisition time)	Standard thermal sensitivity
Acquisition Time	Seconds	Seconds to several hours	5 seconds to 10 hours
Bias Requirement	Standard DC bias	Modulated bias required	Standard DC bias

Industry-Leading Sensitivity. Proven at µK Levels.

Thermal-HS is available with a 1024×1024 MWIR sensor — the highest pixel resolution available in an infrared hot spot detection system. Our Modulation Mode and PST techniques push sensitivity further still, continuously improving signal-to-noise ratio with acquisition time.

Thermal-HS Modulation Mode provides a typical sensitivity improvement of 100× over standard steady-state methods — capable of detecting µW-level shorts.

Part of the QuantumScope™ Failure Analysis Platform

Thermal-HS is one of three complementary techniques on the QuantumScope™ system — giving failure analysis engineers complete coverage across thermal, electrical, and optical defect types on a single platform, with consistent biasing and seamless technique switching.