To ensure the most effective measurement approach, we ask you to complete a Thermal Analysis Request Form before analysis begins. This form helps us understand your device, operating conditions, and goals, and allows our engineers to recommend the most appropriate InfraScope™ measurement method for your application.
InfraScope™ Thermal Analysis
InfraScope™ is our thermal microscopy platform for visualizing where heat is generated and how temperature is distributed in operating devices.
Using non-contact infrared and thermoreflectance techniques, InfraScope™ thermal analysis delivers calibrated temperature maps, and time-resolved thermal measurements — without invasive probing or destructive sample preparation.
Whether you’re troubleshooting a failure, validating a thermal design, or investigating device reliability, our engineers will work with you to define the right measurement approach and deliver results you can act on.
What InfraScope™ Thermal Analysis Can Help You Do
Map Temperature Distribution
Generate true 2D temperature maps with emissivity correction to evaluate thermal design quality, die attach integrity, packaging performance, and relative temperature differences across a device.
Capture Dynamic Thermal Events
Measure how temperature changes during pulsed or time-varying operation. Transient measurements reveal fast heating effects that steady-state analysis alone can’t detect.
Resolve Fine-Scale Temperature Features
For small structures and low temperature rise, the T°Imager™ thermoreflectance module delivers very high spatial resolution using visible-light techniques — ideal where infrared resolution is insufficient.
Understand Measurement Accuracy
InfraScope™ measurements provide detailed spatial and temporal thermal data. Absolute temperature values are typically accurate to ±5%, depending on sample properties, emissivity, and measurement configuration.
Common Applications
Evaluating power dissipation and heating under operating conditions
Verifying die attach, solder attach, and thermal interfaces
Supporting failure analysis and reliability investigations
Studying dynamic heating during functional operation
What to Expect After You Submit a Request
Sending a device for thermal analysis is a straightforward process. Here’s what happens after you complete the request form:
1
Request Review
Our engineers review your device information, operating conditions, and analysis goals. We may also ask about sample handling requirements or supporting documentation before proceeding.
2
Recommended Approach & Quote
We’ll confirm the most appropriate InfraScope™ measurement method for your application and provide a quote. Pricing and turnaround are based on your specific requirements.
3
Analysis & Deliverables
Once approved, your analysis is scheduled and completed. Results are delivered as thermal images, temperature maps, plots, or data tables.
Request an InfraScope™ Thermal Analysis
Fill out the form below to submit your request. Not sure which measurement method is right for your application? Select “Let QFI Determine the Best InfraScope Method” in Section 3 and our engineers will recommend the most appropriate approach based on your device and goals.
Pricing and turnaround time are determined based on your specific analysis requirements. You will receive a quote after your request is reviewed.
Have Questions Before You Submit?
Whether you want to talk through your application first or learn more about the InfraScope™ platform, our team is ready to help.