We combine non-destructive electrical, thermal, and imaging-based techniques to localize defects, identify root cause, and support corrective action — without unnecessary sample destruction.
Failure Analysis at QFI
Our advanced semiconductor failure analysis tools help accurately pinpoint defects, the first step to getting to root cause of any functional or reliability issue.
Our approach is built around the QuantumScope™, our failure analysis microscope platform. A single QuantumScope™ system can be configured with multiple sensors and techniques — including emmi™ photoemission, XIVA™ LSIM laser signal injection, and Thermal-HS infrared hot spot detection — allowing engineers to move between analytical methods without disturbing the device under test.
Failure analysis is an iterative process. Initial non-destructive techniques are used to narrow the region of interest, followed by more targeted methods as the investigation develops. The most effective analyses are achieved when failure symptoms, electrical conditions, and usage history are well understood — which is why we ask customers to complete a request form before analysis begins.
What QuantumScope™ Failure Analysis Can Help You Do
Localize Electrical Defects
emmi™ photoemission microscopy and Thermal-HS infrared hot spot detection identify leakage paths, gate oxide defects, junction failures, and abnormal current flow while devices are powered and operating — without physical probing or destructive sample preparation.
Identify Resistive and Ohmic Defects
XIVA™ LSIM (Laser Signal Injection Microscopy) locates shorts, resistive vias, junction defects, and other impedance-related failures by scanning a laser over the device while monitoring the I/V response for laser-induced changes.
Correlate Electrical Symptoms with Physical Root Cause
By combining photoemission, laser, and thermal data collected on a single QuantumScope™ system — with the device under test remaining in place throughout — we bridge the gap between observed failure symptoms and the underlying physical defect mechanism.
Support Root-Cause and Reliability Investigations
Failure analysis results provide actionable insight to support process debugging, design validation, supplier evaluation, and long-term reliability assessment.
Find Thermal Hot Spots
Quickly localize areas of excessive heat caused by shorts, leakage paths, or abnormal current flow — without invasive probing or destructive preparation.
Common Applications
Debugging electrical test failures and customer returns
Localizing shorts, opens, leakage, and abnormal power dissipation
Investigating yield loss and process excursions
Supporting corrective action and design improvements
Validating qualification and reliability results
What to Expect After You Submit a Request
Submitting a device for failure analysis is a straightforward process. Here’s what happens after you complete the request form:
1
Request Review
Our engineers review your device information, failure history, and operating conditions. We may follow up to clarify electrical requirements, sample handling needs, or supporting documentation before proceeding.
2
Recommended Approach & Quote
We’ll confirm the most appropriate QuantumScope™ analysis techniques for your failure mode and provide a quote. Pricing and turnaround are based on your specific requirements.
3
Analysis & Deliverables
Once approved, your analysis is scheduled and completed. Results are delivered in your preferred format — annotated images, localization maps, data tables, or a full engineering summary report.
Request Failure Analysis Services
To ensure an efficient and effective investigation, please complete the form below before analysis begins. This helps our engineers understand your device, failure history, and operating conditions — so we can develop an optimized diagnostic plan from the start.
Not sure which analysis techniques are needed? Select “Let QFI recommend the appropriate methods” in Section 5 of the form.
Pricing and turnaround time are determined based on your specific analysis requirements. You will receive a quote after your request is reviewed.
Ready to Solve Your Next Failure Analysis Challenge?
Whether you need a single investigation or ongoing analytical support, our engineers are ready to help.